Internet of Things Module


  • Quad core A53 processor @ 1.4GHz
  • Mali-T720 GPU with OpenGL ES3.1
  • 1GB Low Power DDR3 or 2GB Low Power DDR4 options
  • On board eMMC storage
  • WiFI & BLE optional
  • Android, Ubuntu LTS, Buildroot and BalenaOS support

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TM3 offers high performance, low power in a tiny module which can be readily incorporated into the most demanding embedded applications.

High Performance

The TM3 features quad core ARM A53 processing with a flexible clocking scheme up to 1.4GHz. This makes the TM3 suitable for running demanding applications on high level operating systems like Ubuntu Linux, Buildroot, BalenaOS and Android 9.

Extensive flexible interfaces.

TM3 offers an incredible balance of legacy and modern interfaces such as GPIO, RS232/485, USB2.0 and 3.0 and PCIe, enabling integration into almost any target application. The 50-way expansion header supports audio, GPIO and digital expansion via I2C and SPI to provide simple development and assembly of application specific expansion boards. e.g. CANBUS, temperature or air quality sensors, etc.

Universal connectivity

The TM3 is ideal for IoT products. It provides Wi-Fi (802.11 a/b/g 2.4Ghz), BLE 5.0) and Ethernet, and when combined with a suitable host board such as HB8/9 the M.2 and SIM card interface can support 2G, 3G, 4G & 5G modems as well as LTE CAT-M1, NB-IoT and GNSS devices.

Low Cost

The TM3 is designed to be low cost and be a true embedded platform with long life. TM3 uses high reliability connectors to connect to your host board. The Wi-Fi and Bluetooth is implemented to reduce the cost of R&TTE testing. Typically only a four layer PCB is required for the carrier board thereby keeping the cost of your product as low as possible.

Long Life

The TM3 processor is intended to be available for at least 10 years, and Blue Chip Technology have a long history of supporting their hardware and OS platforms for many years

Small Form Factor

Measuring just 42mm x 30mm x 5.3 mm the TM3 is incredibly small and easy to integrate into the tightest enclosures.

User interaction

TM3 supports a wide variety of LCD sizes and both capacitive and resistive touch applications. If you are interested in a solution integrated with LCD, Touch panel and bezel please check out HB8/9 and LCDs for the TM3 in our Beta section.

HB8 and 9 also offer a HDMI output which can be combined with a LCD in Linux it also support dual independent screen operation.

Technical Specifications

CPU ManufacturerAllwinner
CPU SeriesARM Cortex™ A53
CPU Speed1.4GHz
CPU DetailsFloating Point Unit
L2 Cache
CPU CoresQuad Core
Inputs / OutputsGPIO
RF CommsWi-Fi 802.11 abgn
Serial CommsEthernet 10/100
PCIe 2.0x1
USB 2.0
USB 3.0
Audio / Visual
AudioAnalog Audio Headphone Out
Analog Audio Line In
Analog Audio Line Out
Analog Audio Mic In
Digital Audio
GraphicsMali-T720 3D Acceleration
OpenGL ES3.1
Video Decoder: H.265 4K@60fps, H264
Video Encoder: H.264 1080p@60fps
Operating SystemAndroid
Linux - BalenaOS
Linux - Buildroot
Linux - Ubuntu
Ubuntu22.04 LTS
Temperature-20° to +70° C
Power Supply3.3 Volts DC

See datasheet for more detailed information.

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File NameDescriptionDownload
Android for TM3 User ManualUser Guide for Android running on the TM1 computer-on-module. It provides the necessary information required to starting building Android applications. 1.29 MB
Linux User Guide for TM3 / HB8-9User Guide for building Linux operating systems on the TM1 computer-on-module and HB8-9 hostboard platform. 1.36 MB
HB9 Technical User GuideTechnical User Guide for the HB9 carrier board (for TM computer-on-modules). 3.01 MB
HB8 Technical User GuideTechnical User Guide for the HB8 carrier board (for TM computer-on-modules). 3.01 MB
TM3 DatasheetDatasheet for TM3 computer-on-module. 232.42 KB
RS485 Application NoteApplication note for the use of RS485 on a TM1 / TM3 / XE1 442.00 KB


File NameDescriptionDownload
Embedded Linux SDK for TM3Linux SDK for the TM3 and HB8/9. 6.03 GB
Embedded Linux Virtual Machine for TM3Virtual Machine for Linux on the TM3 and HB8/9 12.59 GB
Android APIs for TM3Android APIs for the TM3 system-on-module. 18.20 MB
Embedded Linux SDK for TM1 + HB Carrier BoardsLinux SDK for the TM1 and HB5/6/etc. 7.31 GB
Embedded Linux Virtual Machine for TM1 + HB Carrier BoardsVirtual Machine for Linux on the TM1 and HB5/6/etc. 19.18 GB
Android APIs for TM1Android APIs for the TM1 system-on-module. 150.97 MB


File NameDescriptionDownload
TM3 Host PCB layoutMechanical data for TM3 module incorporation to a custom hostboard 508.79 KB
HB8 Reference Design for TM3Reference schematics for the HB8 7” LCD host board (for TM3 system-on-modules). HB9 available on request. 1.60 MB
HB8 Reference Design for TM3Reference schematics for the HB8 7” LCD host board (for TM3 system-on-modules). HB9 available on request. 1.60 MB
TM3 DimensionsDimensions of the TM3 computer-on-module. 333.98 KB

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