TM3+HB8/9

Internet of Things Module

LinuxAndroidBluetoothWiFiCapacitive TouchResistive Touch

  • Computer-on-Module and Carrier Board combination
  • Supports HDMI 2.0b, 4.3″, 7.1″, 9.7″ &  12” TFT LCDs
  • Supports Projected Capacitive or Resistive touchscreens
  • USB 3.0 & 2.0 Host and Device ports, 12 digital input & outputs
  • M.2 Key B,  PCIe & USB
  • 10/100 Mbit Ethernet
  • Dual RS232 Ports plus single RS232/422/485 port
  • Stereo audio inputs & outputs and audio amplifier
  • Vertical I/O to minimise width

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Description

Our TM3+HB8/9 SBC provides a range of interfaces with industry standard connectors and supports a 6-36Vdc DC voltage power input. (Note: When used in conjunction with our standard 12” LCD HB9 the LCD backlight only operate with a from 12-36Vdc)

HB8 supports our 4.3” or 7” LCD with capacitive or resistive touch.

HB9 supports our 9.7” or 12” LCD with capacitive touch

When headless or HDMI only operation is required then we recommend use of the HB8 7” as this is our highest volume configuration and therefore the most available.  

Using our TM3 it is the ideal module for an Internet of Things (IoT) device. The TM3+HB8/9 can be used where Wi-Fi, Bluetooth and/or Ethernet is required or a M.2 2G, 3G , 4G or 5G modem can be added to offer cellular connection supported via an onboard SIM card slot. Together with three asynchronous RS232/422/485 ports, the TM3+HB8/9 is an extremely versatile host board which can support a wide range of applications.

The TM3+HB8/9 is also used in our Beta range of embedded touch display modules by combining it with our LCD, touchscreen, mechanicals, cables and Android or Linux operating systems. Ubuntu, Devicetree and Yocto based BalenaOS are supported.

If you require something a little different we can provide the schematics for the carrier board free of charge (under NDA) to help you create your new product as quickly and as risk-free as possible. Please contact us for further details.


Technical Specifications

CPU
CPU ManufacturerAllwinner
CPU SeriesARM Cortex™ A53
CPU Speed1.4GHz
CPU DetailsFloating Point Unit
L2 Cache
NEON
CPU CoresQuad Core
Memory
RAM1GB DDR3
2GB DDR4
Connectivity
Inputs / OutputsGPIO
RF CommsBluetooth 5.0 BLE
Wi-Fi 802.11 abgn
Serial CommsEthernet 10/100
I2C
PCIe 2.0x1
RS232
RS422
RS485
SPI
USB 2.0
USB 3.0
Audio / Visual
AudioAnalog Audio Headphone Out
Analog Audio Line In
Analog Audio Line Out
Analog Audio Mic In
Digital Audio
GraphicsH263 1080p@60fps
H264 4k@30fps
Mali-T720 3D Acceleration
OpenCL1.2
OpenGL ES3.1
Video Decoder: H.265 4K@60fps, H264
Video Encoder: H.264 1080p@60fps
DisplayHB8 - RGB LCD
HB9 - LVDS
HDMI 2.0b
Miscellanneous
Operating SystemAndroid
Android 9
Linux - BalenaOS
Linux - Buildroot
Linux - Ubuntu
Ubuntu22.04 LTS
Temperature-20° to +70° C
Power Supply3.3 Volts DC
HB8 4.3”, 7”, HB9 9.7”: 6 to 36Vdc
HB9 12”: 12 to 36Vdc

See datasheet for more detailed information.

Download Datasheet

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Downloads

Documentation

File NameDescriptionDownload
Android for TM3 User ManualUser Guide for Android running on the TM1 computer-on-module. It provides the necessary information required to starting building Android applications. 1.29 MB
Linux User Guide for TM3 / HB8-9User Guide for building Linux operating systems on the TM1 computer-on-module and HB8-9 hostboard platform. 1.36 MB
HB9 Technical User GuideTechnical User Guide for the HB9 carrier board (for TM computer-on-modules). 3.01 MB
HB8 Technical User GuideTechnical User Guide for the HB8 carrier board (for TM computer-on-modules). 3.01 MB
TM3 DatasheetDatasheet for TM3 computer-on-module. 232.42 KB
RS485 Application NoteApplication note for the use of RS485 on a TM1 / TM3 / XE1 442.00 KB

Software

File NameDescriptionDownload
Embedded Linux SDK for TM3Linux SDK for the TM3 and HB8/9. 6.03 GB
Embedded Linux Virtual Machine for TM3Virtual Machine for Linux on the TM3 and HB8/9 12.59 GB
Android APIs for TM3Android APIs for the TM3 system-on-module. 18.20 MB

Designs

File NameDescriptionDownload
HB8 Reference Design for TM3Reference schematics for the HB8 7” LCD host board (for TM3 system-on-modules). HB9 available on request. 1.60 MB
HB8 Reference Design for TM3Reference schematics for the HB8 7” LCD host board (for TM3 system-on-modules). HB9 available on request. 1.60 MB
TM3 DimensionsDimensions of the TM3 computer-on-module. 333.98 KB

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